reliability report for MAX17108ETI+ plastic encapsulated devices may 4, 2009 maxim integrated products 120 san gabriel dr. sunnyvale, ca 94086 MAX17108ETI+ approved by ken wendel quality assurance director, reliability engineering maxim integrated products. all rights reserved. page 1/5
conclusion MAX17108ETI+ the MAX17108ETI+ successfully meets the quality and reliability standards required of all maxim products. in additi on, maxim"s continuous reliability monitoring program ensures that all outgoing product will continue to meet maxim"s quality and reliabili ty standards. table of contents i. ........device description v. ........quality assurance information ii. ........manufacturing information vi. .......reliability evaluation iii. .......packaging information iv. .......die information .....attachments i. device description a. general the max17108 includes a 10-channel high-voltage level-shifting scan driver and a vcom amplifier. the device is optimized for th in-film transistor (tft) liquid-crystal display (lcd) applications. the high-voltage level-shifting scan driver can swing from +38v to -12v and c an swiftly drive capacitive loads. there are two positive supply inputs, which provide flexibility for system design. the operational amplifier features rail-to-rail output, high short-circuit output current, fast slew rate, and wide bandwidth. the max17108 is available in a 28-pin, 5mm x 5mm, lead- free thin qfn package with a maximum thickness of 0.8mm for thin lcd panels. maxim integrated products. all rights reserved. page 2/5
ii. manufacturing information MAX17108ETI+ a. description/function: 10-channel high-voltage scan driver and vcom amplifier for tft lcd panels b. process: s45urs c. number of device transistors: 2918 d. fabrication location: texas e. assembly location: utl thailand f. date of initial production: october 21, 2008 iii. packaging information a. package type: 28-pin tqfn 5x5 b. lead frame: copper c. lead finish: 100% matte tin d. die attach: conductive epoxy e. bondwire: au (1.0 mil dia.) f. mold material: epoxy with silica filler g. assembly diagram: # h. flammability rating: class ul94-v0 i. classification of moisture sensitivity per jedec standard j-std-020-c level 1 j. single layer theta ja: 47c/w k. single layer theta jc: 2.1c/w l. multi layer theta ja: 29c/w m. multi layer theta jc: 2.1c/w iv. die information a. dimensions: 60 x 128 mils b. passivation: si 3 n 4 /sio 2 (silicon nitride/ silicon dioxide c. interconnect: aluminum/0.5% cu d. backside metallization: none e. minimum metal width: metal1 = 0.5 / metal2 = 0.6 / metal3 = 0.6 microns (as drawn) f. minimum metal spacing: metal1 = 0.45 / metal2 = 0.5 / metal3 = 0.6 microns (as drawn) g. bondpad dimensions: 5 mil. sq. h. isolation dielectric: sio 2 i. die separation method: wafer saw maxim integrated products. all rights reserved. page 3/5
v. quality assurance information a. quality assurance contacts: ken wendel (director, reliability engineering) bryan preeshl (managing director of qa) b. outgoing inspection level: 0.1% for all electrical parameters guaranteed by the datasheet. 0.1% for all visual defects. c. observed outgoing defect rate: < 50 ppm d. sampling plan: mil-std-105d vi. reliability evaluation a. accelerated life test MAX17108ETI+ the results of the 135c biased (static) life test are shown in table 1. using these results, the failure rate ( ) is calculated as follows: = 1 = 1.83 (chi square value for mttf upper limit) mttf 192 x 4340 x 46 x 2 (where 4340 = temperature acceleration factor assuming an activation energy of 0.8ev) = 23.3 x 10 -9 = 23.3 f.i.t. (60% confidence level @ 25c) the following failure rate represents data collected from maxim?s reliability monitor program. maxim performs quarterly 1000 hour life test monitors on its processes. this data is published in the product reliability report found at http://www.maxim-i c.com/. current monitor data for the s45urs process results in a fit rate of 0.9 @ 25c and 13.84 @ 55c (0.8 ev, 60% ucl) b. moisture resistance tests the industry standard 85c/85%rh or hast testing is monitored per device process once a quarter. c. e.s.d. and latch-up testing the pf52 die type has been found to have all pins able to withstand a hbm transient pulse of +/-2500 v per jedec jesd22-a114. latch-up testing has shown that this device withstands a current of +/-100 ma, 1.5x vccmax overvoltage per jesd78. maxim integrated products. all rights reserved. page 4/5
table 1 reliability evaluation test results MAX17108ETI+ MAX17108ETI+ test item test condition failure identification sample size number of failures static life test (note 1) ta = 135c biased time = 192 hrs. dc parameters 47 0 & functionality moisture testing (note 2) 85/85 ta = 85c rh = 85% biased time = 1000hrs. dc parameters & functionality 77 0 mechanical stress (note 2) temperature cycle -65c/150c 1000 cycles method 1010 dc parameters & functionality 77 0 note 1: life test data may represent plastic dip qualification lots. note 2: generic package/process data maxim integrated products. all rights reserved. page 5/5
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